Shenzhen Fastprint Circuit Tech Co Ltd

Research Shenzhen Fastprint Circuit Tech Co Ltd (002436.SZ) on Bullrun: market cap CNY 59.52B, P/E 269.4, dividend yield 0.1%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is CNY 59.52B; P/E is 269.4; dividend yield is 0.1%.

Peer valuation comparison

Latest P/E is 269.38x versus a Technology sector median of 24.16x (1015.0% above).

Latest dividend yield is 0.08% versus a Technology sector median of 2.02% (96.0% below).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18CNY 59.52B269.40.1%0.03

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0.03 CNY, yield 0.1%.

About Shenzhen Fastprint Circuit Tech Co Ltd

Shenzhen Fastprint Circuit Tech Co.,Ltd., together with its subsidiaries, designs, produces, purchases, and sells printed circuit boards in China and internationally. The company offers PCB, including HDI, high-frequency, and high-speed products; IC substrate, such as CSP, FC0CSP, SiP, FMC, and PBGA; FPC comprising rigid-flex and flexible board; and semiconductor test board which includes load board, probe card, BIB, and Interposer.

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Frequently asked questions

What is Shenzhen Fastprint Circuit Tech Co Ltd's market cap?

Shenzhen Fastprint Circuit Tech Co Ltd's market capitalization is CNY 59.52B.

What is Shenzhen Fastprint Circuit Tech Co Ltd's P/E ratio?

Shenzhen Fastprint Circuit Tech Co Ltd's price-to-earnings (P/E) ratio is 269.4.

Does Shenzhen Fastprint Circuit Tech Co Ltd pay a dividend?

Shenzhen Fastprint Circuit Tech Co Ltd has a dividend yield of 0.1%.

What does Shenzhen Fastprint Circuit Tech Co Ltd do?

Shenzhen Fastprint Circuit Tech Co.,Ltd., together with its subsidiaries, designs, produces, purchases, and sells printed circuit boards in China and internationally. The company offers PCB, including HDI, high-frequency, and high-speed products; IC substrate, such as CSP, FC0CSP, SiP, FMC, and PBGA; FPC comprising rigid-flex and flexible board; and semiconductor test board which includes load board, probe card, BIB, and Interposer.