Taiwan IC Packaging Corporation
Research Taiwan IC Packaging Corporation (3372.TWO) on Bullrun: market cap TWD 3.67B. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker3372.TWO
- ExchangeTWO
- CountryTaiwan
- SectorTechnology
- IndustrySemiconductors
- CurrencyTWD
- Market capTWD 3.67B
- Financial periodQ2 2026
- RevenueTWD 338.32M
- Net income-TWD 12.98M
- Free cash flow-TWD 34.35M
- Gross margin2.0%
Valuation Snapshot
latest market cap is TWD 3.67B.
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | TWD 3.67B | n/a | n/a | 0 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 0 TWD.
About Taiwan IC Packaging Corporation
Taiwan IC Packaging Corporation develops semiconductor packaging and testing services in Taiwan, South Korea, the United States, and internationally. It offers advanced and traditional lead frame type integrated circuit packaging services. The company was founded in 1998 and is based in Kaohsiung, Taiwan.
ETFs that hold Taiwan IC Packaging Corporation
US-listed ETFs
Taiwan IC Packaging Corporation is held by 3 US-listed ETFs, going by the latest portfolios they filed with the SEC, most traded first:
| ETF | Weight | Fee |
|---|---|---|
| Dimensional Emerging Core Equity Market ETF (DFAE) | <0.01% | 0.29% |
| Dimensional Emerging Markets Core Equity 2 ETF (DFEM) | <0.01% | 0.39% |
| Dimensional World ex U.S. Core Equity 2 ETF (DFAX) | <0.01% | 0.28% |
Portfolios as filed with the SEC on Form N-PORT, dated July 2026. Brokers in the EU generally do not offer US-listed ETFs to retail investors.
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Frequently asked questions
What is Taiwan IC Packaging Corporation's market cap?
Taiwan IC Packaging Corporation's market capitalization is TWD 3.67B.
What does Taiwan IC Packaging Corporation do?
Taiwan IC Packaging Corporation develops semiconductor packaging and testing services in Taiwan, South Korea, the United States, and internationally. It offers advanced and traditional lead frame type integrated circuit packaging services. The company was founded in 1998 and is based in Kaohsiung, Taiwan.