Zen Voce Corporation
Research Zen Voce Corporation (3581.TWO) on Bullrun: market cap TWD 5.38B, P/E 44.9, dividend yield 0.7%. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker3581.TWO
- ExchangeTWO
- CountryTaiwan
- SectorTechnology
- IndustrySemiconductors
- CurrencyTWD
- Market capTWD 5.38B
- P/E44.9
- Dividend yield0.7%
- Financial periodQ2 2026
- RevenueTWD 439.75M
- Net incomeTWD 31.89M
- Free cash flow-TWD 133.70M
- Gross margin30.0%
Valuation Snapshot
latest market cap is TWD 5.38B; P/E is 44.9; dividend yield is 0.7%.
Peer valuation comparison
Latest P/E is 44.89x versus a Technology sector median of 23.76x (88.9% above).
Latest dividend yield is 0.72% versus a Technology sector median of 2.17% (66.8% below).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | TWD 5.38B | 44.9 | 0.6% | 0.6 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 0.6 TWD, yield 0.7%.
About Zen Voce Corporation
Zen Voce Corporation manufactures, processes, maintains, and sells semiconductor packaging and testing equipment and fixtures in Taiwan, the United States, China, Singapore, and internationally. The company engages in the design and manufacturing of equipment, including IC packaging machines and bumping products, wafer cutting and cleaning machines, and board cutting and cleaning machines;
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Frequently asked questions
What is Zen Voce Corporation's market cap?
Zen Voce Corporation's market capitalization is TWD 5.38B.
What is Zen Voce Corporation's P/E ratio?
Zen Voce Corporation's price-to-earnings (P/E) ratio is 44.9.
Does Zen Voce Corporation pay a dividend?
Zen Voce Corporation has a dividend yield of 0.7%.
What does Zen Voce Corporation do?
Zen Voce Corporation manufactures, processes, maintains, and sells semiconductor packaging and testing equipment and fixtures in Taiwan, the United States, China, Singapore, and internationally. The company engages in the design and manufacturing of equipment, including IC packaging machines and bumping products, wafer cutting and cleaning machines, and board cutting and cleaning machines; and test products, such as wafer test probe card PCBs, IC test HIFIX and CHANG kits, SOCKET IC test products, IC handlers, and SOCKET IC burn-in test products.