Tekscend Photomask Corp.
Research Tekscend Photomask Corp. (429A.T) on Bullrun: market cap JPY 340.29B, P/E 13.4, dividend yield 2.7%. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker429A.T
- ExchangeTSE
- CountryJapan
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CurrencyJPY
- Market capJPY 340.29B
- P/E13.4
- Dividend yield2.7%
- Financial periodQ3 2025
- RevenueJPY 31.70B
- Net incomeJPY 6.88B
- Free cash flowJPY 476.00M
- Gross margin35.0%
Valuation Snapshot
latest market cap is JPY 340.29B; P/E is 13.4; dividend yield is 2.7%.
Peer valuation comparison
Latest P/E is 13.42x versus a Technology sector median of 24.16x (44.4% below).
Latest dividend yield is 2.69% versus a Technology sector median of 2.02% (33.2% above).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | JPY 340.29B | 13.4 | 2.7% | 91 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 91 JPY, yield 2.7%.
About Tekscend Photomask Corp.
Tekscend Photomask Corp. manufactures and distributes semiconductor photomasks in Japan, China, Taiwan, South Korea, the United States, Europe, and internationally. It offers photomasks, including binary and phase shift masks, and EUV photomasks; 3D photomasks; and silicon stencil masks/molds for nanoimprint, including quartz and silicon molds.
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Frequently asked questions
What is Tekscend Photomask Corp.'s market cap?
Tekscend Photomask Corp.'s market capitalization is JPY 340.29B.
What is Tekscend Photomask Corp.'s P/E ratio?
Tekscend Photomask Corp.'s price-to-earnings (P/E) ratio is 13.4.
Does Tekscend Photomask Corp. pay a dividend?
Tekscend Photomask Corp. has a dividend yield of 2.7%.
What does Tekscend Photomask Corp. do?
Tekscend Photomask Corp. manufactures and distributes semiconductor photomasks in Japan, China, Taiwan, South Korea, the United States, Europe, and internationally. It offers photomasks, including binary and phase shift masks, and EUV photomasks; 3D photomasks; and silicon stencil masks/molds for nanoimprint, including quartz and silicon molds. It also photomasks for various applications, such as MEMS, semiconductor packaging substrates, LED, tool accuracy control, high resolution printing, IC bump packaging, micro lens array, thermal head, and OEM qualification and research.