Micro-Mechanics (Holdings) Ltd.

Research Micro-Mechanics (Holdings) Ltd. (5DD.SI) on Bullrun: market cap SGD 363.61M, P/E 23.8, dividend yield 2.3%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is SGD 363.61M; P/E is 23.8; dividend yield is 2.3%.

Peer valuation comparison

Latest P/E is 23.82x versus a Technology sector median of 24.14x.

Latest dividend yield is 2.29% versus a Technology sector median of 2% (14.5% above).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-17SGD 363.61M23.82.3%0.06

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0.06 SGD, yield 2.3%.

About Micro-Mechanics (Holdings) Ltd.

Micro-Mechanics (Holdings) Ltd. designs, manufactures, and markets precision components for the wafer-fabrication equipment and other industries. The company offers die attach-pick-up products, such as rubber tips, high-temp plastic tools, tungsten carbide die collets, sensor assemblies, and vacuum wand tools; die attach-dispensing products, including dispensing nozzle adaptors, dispense nozzles, pen dispensing assemblies, writing pen nozzle tips, and epoxy stamping tools;

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Frequently asked questions

What is Micro-Mechanics (Holdings) Ltd.'s market cap?

Micro-Mechanics (Holdings) Ltd.'s market capitalization is SGD 363.61M.

What is Micro-Mechanics (Holdings) Ltd.'s P/E ratio?

Micro-Mechanics (Holdings) Ltd.'s price-to-earnings (P/E) ratio is 23.8.

Does Micro-Mechanics (Holdings) Ltd. pay a dividend?

Micro-Mechanics (Holdings) Ltd. has a dividend yield of 2.3%.

What does Micro-Mechanics (Holdings) Ltd. do?

Micro-Mechanics (Holdings) Ltd. designs, manufactures, and markets precision components for the wafer-fabrication equipment and other industries. The company offers die attach-pick-up products, such as rubber tips, high-temp plastic tools, tungsten carbide die collets, sensor assemblies, and vacuum wand tools; die attach-dispensing products, including dispensing nozzle adaptors, dispense nozzles, pen dispensing assemblies, writing pen nozzle tips, and epoxy stamping tools; and die attach-die ejection products comprising ejector needles, needle holders/pepper pots, and needle holder seals.