ASEC International Corporation
Research ASEC International Corporation (6113.TWO) on Bullrun: market cap TWD 1.16B, P/E 36.9. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker6113.TWO
- ExchangeTWO
- CountryTaiwan
- SectorTechnology
- IndustrySemiconductors
- CurrencyTWD
- Market capTWD 1.16B
- P/E36.9
- Financial periodQ2 2026
- RevenueTWD 277.67M
- Net incomeTWD 30.99M
- Free cash flow-TWD 23.18M
- Gross margin12.3%
Valuation Snapshot
latest market cap is TWD 1.16B; P/E is 36.9.
Peer valuation comparison
Latest P/E is 36.94x versus a Technology sector median of 23.76x (55.5% above).
Latest P/E is 36.94x versus a Taiwan median of 18.67x (97.9% above).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | TWD 1.16B | 36.9 | n/a | 0.5 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 0.5 TWD.
About ASEC International Corporation
ASEC International Corporation engages in the sale of computer and network peripherals, and electronic components in Taiwan, Hong Kong, China, Asia, and internationally. The company distributes its products under the BOSCH, CORTINA, FIBOCOM, RAMXEED, Infinity, ISSI, MEDIATEK, METANOIA, MICROCHIP, MORSE MICRO, PDI DIGITAL, REALTEK, and ANJET brand names.
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Frequently asked questions
What is ASEC International Corporation's market cap?
ASEC International Corporation's market capitalization is TWD 1.16B.
What is ASEC International Corporation's P/E ratio?
ASEC International Corporation's price-to-earnings (P/E) ratio is 36.9.
What does ASEC International Corporation do?
ASEC International Corporation engages in the sale of computer and network peripherals, and electronic components in Taiwan, Hong Kong, China, Asia, and internationally. The company distributes its products under the BOSCH, CORTINA, FIBOCOM, RAMXEED, Infinity, ISSI, MEDIATEK, METANOIA, MICROCHIP, MORSE MICRO, PDI DIGITAL, REALTEK, and ANJET brand names. Its products are used in PC, internet, telecommunication, MCU, electronic products, multimedia software and hardware, and energy saving and carbon reduction products.