Ventec International Group Co.,Ltd.

Research Ventec International Group Co.,Ltd. (6672.TW) on Bullrun: market cap TWD 48.24B, P/E 87.4, dividend yield 0.6%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is TWD 48.24B; P/E is 87.4; dividend yield is 0.6%.

Peer valuation comparison

Latest P/E is 87.43x versus a Technology sector median of 24.14x (262.1% above).

Latest dividend yield is 0.57% versus a Technology sector median of 2% (71.5% below).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18TWD 48.24B87.40.6%3.35

Dividend history

Latest trailing dividend snapshot: annual dividend/share 3.35 TWD, yield 0.6%.

About Ventec International Group Co.,Ltd.

Ventec International Group Co.,Ltd. engages in research and development, production, and sale of copper foil substrates (CCL), heat dissipation aluminum substrates (IMS) and prepreg. The company offers standard FR4, lead free assembly, halogen free products, tec-thermal/thermal management and insulated metal substrate, polyimide, tec-speed/signal integrity and high frequency products, tec-packs/ IC packaging, pro-bond and thermal bonds, and flex/flex rigid products, as well as products for special applications.

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Frequently asked questions

What is Ventec International Group Co.,Ltd.'s market cap?

Ventec International Group Co.,Ltd.'s market capitalization is TWD 48.24B.

What is Ventec International Group Co.,Ltd.'s P/E ratio?

Ventec International Group Co.,Ltd.'s price-to-earnings (P/E) ratio is 87.4.

Does Ventec International Group Co.,Ltd. pay a dividend?

Ventec International Group Co.,Ltd. has a dividend yield of 0.6%.

What does Ventec International Group Co.,Ltd. do?

Ventec International Group Co.,Ltd. engages in research and development, production, and sale of copper foil substrates (CCL), heat dissipation aluminum substrates (IMS) and prepreg. The company offers standard FR4, lead free assembly, halogen free products, tec-thermal/thermal management and insulated metal substrate, polyimide, tec-speed/signal integrity and high frequency products, tec-packs/ IC packaging, pro-bond and thermal bonds, and flex/flex rigid products, as well as products for special applications.