Micro Silicon Electronics Co., Ltd.

Research Micro Silicon Electronics Co., Ltd. (8162.TW) on Bullrun: market cap TWD 4.18B, P/E 45.4, dividend yield 2.7%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is TWD 4.18B; P/E is 45.4; dividend yield is 2.7%.

Peer valuation comparison

Latest P/E is 45.37x versus a Technology sector median of 23.76x (91.0% above).

Latest dividend yield is 2.65% versus a Technology sector median of 2.17% (22.1% above).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18TWD 4.18B45.42.5%1.5

Dividend history

Latest trailing dividend snapshot: annual dividend/share 1.5 TWD, yield 2.7%.

About Micro Silicon Electronics Co., Ltd.

Micro Silicon Electronics Co., Ltd. provides semiconductor backend services in Taiwan, rest of Asia, the United States, and Europe. The company offers semiconductor testing services, such as CP and FT testing; wafer thinning services, including back grinding and backside metallization, and frontside metallization; and semiconductor packaging services comprising COB and COG dicing, and WLCSP-DPS. It also engages in the design, processing, testing, manufacture, and sale of integrated circuits.

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Frequently asked questions

What is Micro Silicon Electronics Co., Ltd.'s market cap?

Micro Silicon Electronics Co., Ltd.'s market capitalization is TWD 4.18B.

What is Micro Silicon Electronics Co., Ltd.'s P/E ratio?

Micro Silicon Electronics Co., Ltd.'s price-to-earnings (P/E) ratio is 45.4.

Does Micro Silicon Electronics Co., Ltd. pay a dividend?

Micro Silicon Electronics Co., Ltd. has a dividend yield of 2.7%.

What does Micro Silicon Electronics Co., Ltd. do?

Micro Silicon Electronics Co., Ltd. provides semiconductor backend services in Taiwan, rest of Asia, the United States, and Europe. The company offers semiconductor testing services, such as CP and FT testing; wafer thinning services, including back grinding and backside metallization, and frontside metallization; and semiconductor packaging services comprising COB and COG dicing, and WLCSP-DPS. It also engages in the design, processing, testing, manufacture, and sale of integrated circuits. In addition, the company offers probe card maintenance services.