Niche-Tech Semiconductor Materials Limited

Research Niche-Tech Semiconductor Materials Limited (8490.HK) on Bullrun: market cap HKD 56.44M. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is HKD 56.44M.

Five-year financial history

YearRevenueNet incomeFree cash flowGross marginDiluted EPSCashTotal debtEquity
FY2025HKD 146.94M-HKD 38.85M-HKD 81.56M13.7%n/aHKD 6.75MHKD 104.01MHKD 141.89M
FY2024HKD 194.87M-HKD 43.08M-HKD 111.27M18.0%-0.06HKD 19.69MHKD 147.43MHKD 172.54M
FY2023HKD 212.59MHKD 510.00K-HKD 143.66M25.8%0HKD 26.97MHKD 110.01MHKD 220.94M
FY2022HKD 217.86MHKD 8.64M-HKD 72.29M26.6%0.01HKD 40.22MHKD 46.48MHKD 228.65M
FY2021n/an/an/an/a0.01n/an/an/a

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18HKD 56.44Mn/an/a0

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0 HKD.

YearDividends/share
FY20230 HKD
FY20220.01 HKD
FY20210 HKD

About Niche-Tech Semiconductor Materials Limited

Niche-Tech Semiconductor Materials Limited, an investment holding company, engages in the development, manufacture, and sale of semiconductor packaging materials in the People's Republic of China, Hong Kong, and internationally. It provides copper-bonding wires, power copper bonding wires, aluminum silicon bonding wires, heavy aluminum bonding wires, silver alloy bonding wires, pd-coated copper wires, copper alloy bonding wires, gold bonding wires, and gold alloy bonding wires;

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Frequently asked questions

What is Niche-Tech Semiconductor Materials Limited's market cap?

Niche-Tech Semiconductor Materials Limited's market capitalization is HKD 56.44M.

What does Niche-Tech Semiconductor Materials Limited do?

Niche-Tech Semiconductor Materials Limited, an investment holding company, engages in the development, manufacture, and sale of semiconductor packaging materials in the People's Republic of China, Hong Kong, and internationally. It provides copper-bonding wires, power copper bonding wires, aluminum silicon bonding wires, heavy aluminum bonding wires, silver alloy bonding wires, pd-coated copper wires, copper alloy bonding wires, gold bonding wires, and gold alloy bonding wires; and silicone encapsulant for LED filament and COB LED.