UBoT Holding Limited

Research UBoT Holding Limited (8529.HK) on Bullrun: market cap HKD 159.39M, P/E 7.8, dividend yield 6.1%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Ticker8529.HK
ExchangeHK
CountryHong Kong
SectorTechnology
IndustrySemiconductors
CurrencyHKD
Market capHKD 159.39M
P/E7.8
Dividend yield6.1%
Financial periodFY2025
RevenueHKD 199.74M
Revenue growth22.5%
Net incomeHKD 12.81M
Free cash flowHKD 4.62M
Gross margin37.7%

Valuation Snapshot

latest market cap is HKD 159.39M; P/E is 7.8; dividend yield is 6.1%.

Peer valuation comparison

Latest P/E is 7.75x versus a Technology sector median of 24.14x (67.9% below).

Latest dividend yield is 6.13% versus a Technology sector median of 2% (206.5% above).

Five-year financial history

Year	Revenue	Net income	Free cash flow	Gross margin	Diluted EPS	Cash	Total debt	Equity
FY2025	HKD 199.74M	HKD 12.81M	HKD 4.62M	37.7%	n/a	HKD 4.47M	HKD 85.61M	HKD 83.29M
FY2024	HKD 163.07M	-HKD 23.18M	-HKD 40.19M	34.5%	-0.05	HKD 7.54M	HKD 79.06M	HKD 73.79M
FY2023	HKD 188.97M	HKD 5.04M	HKD 13.10M	38.1%	0.01	HKD 1.07M	HKD 73.41M	HKD 61.38M
FY2022	HKD 257.57M	HKD 21.80M	HKD 19.43M	39.6%	0.04	HKD 5.90M	HKD 85.69M	HKD 55.79M
FY2021	n/a	n/a	n/a	n/a	0.05	n/a	n/a	n/a

Valuation history

Year	Snapshot date	Market cap	P/E	Dividend yield	Annual dividend/share
2026	2026-10-18	HKD 159.39M	7.8	6.5%	0.02

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0.02 HKD, yield 6.1%.

Year	Dividends/share
FY2025	0.01 HKD

About UBoT Holding Limited

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Frequently asked questions

What is UBoT Holding Limited's market cap?

UBoT Holding Limited's market capitalization is HKD 159.39M.

What is UBoT Holding Limited's P/E ratio?

UBoT Holding Limited's price-to-earnings (P/E) ratio is 7.8.

Does UBoT Holding Limited pay a dividend?

UBoT Holding Limited has a dividend yield of 6.1%.

What does UBoT Holding Limited do?

UBoT Holding Limited, an investment holding company, engages in the research and development, manufacture, and sale of back-end semiconductor transport media, micro-electro-mechanical-system (MEMS), and sensor packaging products. The company operates through Back-end Semiconductor Transport Media; and MEMS and Sensor Packaging segments. The company offers tray and carrier tape that are primarily used for the protection of semiconductor devices, including power discrete semiconductor device, optoelectronic, integrated circuits (IC) and sensors, etc.