Firan Technology Group Corporation
Research Firan Technology Group Corporation (FTG) on Bullrun: market cap CAD 678.67M, P/E 45.7. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- TickerFTG
- ExchangeTO
- CountryCanada
- SectorIndustrials
- IndustryAerospace & Defense
- CurrencyCAD
- Market capCAD 678.67M
- P/E45.7
- Financial periodQ2 2026
- RevenueCAD 52.74M
- Net incomeCAD 5.04M
- Free cash flowCAD 3.59M
- Gross margin36.5%
Valuation Snapshot
latest market cap is CAD 678.67M; P/E is 45.7.
Peer valuation comparison
Latest P/E is 45.69x versus a Industrials sector median of 21.2x (115.6% above).
Latest P/E is 45.69x versus a Canada median of 15.17x (201.2% above).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-05 | CAD 678.67M | 45.7 | n/a | 0 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 0 CAD.
About Firan Technology Group Corporation
Firan Technology Group Corporation manufactures and sells aerospace and defense electronic products and subsystems in Canada, the United States, Asia, Europe China, internationally. The company operates in two segments, FTG Circuits and FTG Aerospace. It offers semi additive process technologies, high density interconnect products, high temperature rigid flex printed, RF boards, thermal management, and rigid flex and assembly products.
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Frequently asked questions
What is Firan Technology Group Corporation's market cap?
Firan Technology Group Corporation's market capitalization is CAD 678.67M.
What is Firan Technology Group Corporation's P/E ratio?
Firan Technology Group Corporation's price-to-earnings (P/E) ratio is 45.7.
What does Firan Technology Group Corporation do?
Firan Technology Group Corporation manufactures and sells aerospace and defense electronic products and subsystems in Canada, the United States, Asia, Europe China, internationally. The company operates in two segments, FTG Circuits and FTG Aerospace. It offers semi additive process technologies, high density interconnect products, high temperature rigid flex printed, RF boards, thermal management, and rigid flex and assembly products.