Chipmos Technologies Inc

Research Chipmos Technologies Inc (IMOS) on Bullrun: valuation model: 67.7% overvalued, market cap USD 2.04B, P/E 77.1, dividend yield 1.3%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

• TickerIMOS
• ExchangeNASDAQ
• CountryTaiwan
• SectorTechnology
• IndustrySemiconductors
• CurrencyUSD
• Valuation signal67.7% overvalued
• Market capUSD 2.04B
• P/E77.1
• Dividend yield1.3%
• Financial periodQ1 2026
• RevenueUSD 25.34B
• Net incomeUSD 504.89M
• Free cash flow-USD 1.06B
• Gross margin11.7%

Valuation Snapshot

Bullrun's latest valuation model marks Chipmos Technologies Inc as 67.7% overvalued; latest market cap is USD 2.04B; P/E is 77.1; dividend yield is 1.3%.

About Chipmos Technologies Inc

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, and internationally. It operates through five segments: Testing; Assembly; Display Panel Driver Semiconductor Assembly and Testing; Bumping; and Others. The company offers leadframe-based packages, such as the small outline package, thin small outline package, and quad flat package;

Frequently asked questions

Is Chipmos Technologies Inc overvalued or undervalued?

Bullrun's valuation model currently marks Chipmos Technologies Inc as 67.7% overvalued.

What is Chipmos Technologies Inc's market cap?

Chipmos Technologies Inc's market capitalization is USD 2.04B.

What is Chipmos Technologies Inc's P/E ratio?

Chipmos Technologies Inc's price-to-earnings (P/E) ratio is 77.1.

Does Chipmos Technologies Inc pay a dividend?

Chipmos Technologies Inc has a dividend yield of 1.3%.

What does Chipmos Technologies Inc do?

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, and internationally. It operates through five segments: Testing; Assembly;