Maruwa Co.,Ltd.
Research Maruwa Co.,Ltd. (MAW.L) on Bullrun: market cap JPY 712.50B, P/E 38.0, dividend yield 0.2%. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- TickerMAW.L
- ExchangeLSE
- CountryJapan
- SectorTechnology
- IndustryElectronic Components
- CurrencyJPY
- Market capJPY 712.50B
- P/E38.0
- Dividend yield0.2%
- Financial periodQ2 2026
- RevenueJPY 19.27B
- Net incomeJPY 4.47B
- Gross margin54.1%
Valuation Snapshot
latest market cap is JPY 712.50B; P/E is 38.0; dividend yield is 0.2%.
Peer valuation comparison
Latest P/E is 38.02x versus a Technology sector median of 28.78x (32.1% above).
Latest dividend yield is 0.18% versus a Technology sector median of 1.78% (89.9% below).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-04 | JPY 712.50B | 38.0 | 0.2% | 110 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 110 JPY, yield 0.2%.
About Maruwa Co.,Ltd.
Maruwa Co.,Ltd. produces and sells ceramics and electronic parts in Japan and internationally. It operates through Ceramic Components Business and Lighting Equipment segments. The company offers ceramics, including ceramic substrates and fillers, metalized/multilayer ceramic substrates, pressed ceramic products, ceramic hermetic seals, and ultra-high purity SiC components; and electronic components and devices, such as antennas, EMC and RF components, and capacitors.
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Frequently asked questions
What is Maruwa Co.,Ltd.'s market cap?
Maruwa Co.,Ltd.'s market capitalization is JPY 712.50B.
What is Maruwa Co.,Ltd.'s P/E ratio?
Maruwa Co.,Ltd.'s price-to-earnings (P/E) ratio is 38.0.
Does Maruwa Co.,Ltd. pay a dividend?
Maruwa Co.,Ltd. has a dividend yield of 0.2%.
What does Maruwa Co.,Ltd. do?
Maruwa Co.,Ltd. produces and sells ceramics and electronic parts in Japan and internationally. It operates through Ceramic Components Business and Lighting Equipment segments. The company offers ceramics, including ceramic substrates and fillers, metalized/multilayer ceramic substrates, pressed ceramic products, ceramic hermetic seals, and ultra-high purity SiC components; and electronic components and devices, such as antennas, EMC and RF components, and capacitors.