SOITEC
Research SOITEC (SOI.PA) on Bullrun: market cap EUR 4.59B. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- TickerSOI.PA
- ExchangeXPAR
- CountryFrance
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CurrencyEUR
- Market capEUR 4.59B
- Financial periodFY2026
- RevenueEUR 592.32M
- Revenue growth-33.5%
- Net income-EUR 220.02M
- Free cash flowEUR 74.29M
- Gross margin16.3%
Valuation Snapshot
latest market cap is EUR 4.59B.
Five-year financial history
| Year | Revenue | Net income | Free cash flow | Gross margin | Diluted EPS | Cash | Total debt | Equity |
|---|---|---|---|---|---|---|---|---|
| FY2026 | EUR 592.32M | -EUR 220.02M | EUR 74.29M | 16.3% | -6.17 | EUR 562.03M | EUR 611.84M | EUR 1.33B |
| FY2025 | EUR 890.85M | EUR 91.84M | EUR 2.05M | 32.1% | 2.56 | EUR 687.67M | EUR 780.15M | EUR 1.59B |
| FY2024 | EUR 977.91M | EUR 178.32M | -EUR 59.88M | 34.0% | 4.88 | EUR 708.22M | EUR 742.74M | EUR 1.49B |
| FY2023 | EUR 1.09B | EUR 233.04M | EUR 34.86M | 37.0% | 6.41 | EUR 787.92M | EUR 638.89M | EUR 1.31B |
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-09-05 | EUR 4.59B | n/a | n/a | 0 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 0 EUR.
About SOITEC
Soitec SA develops and manufactures semiconductor materials in Asia, Europe, and the United States. The company offers CONNECT Radio Frequency Silicon-on-Insulator for smartphone front-end modules; CONNECT FD SOI for AI applications; CONNECT Piezoelectric-on-Insulator RF filters for smartphones; photonics and optical sensing solution for the integration of silicon optical components in data centers;
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Frequently asked questions
What is SOITEC's market cap?
SOITEC's market capitalization is EUR 4.59B.
What does SOITEC do?
Soitec SA develops and manufactures semiconductor materials in Asia, Europe, and the United States. The company offers CONNECT Radio Frequency Silicon-on-Insulator for smartphone front-end modules; CONNECT FD SOI for AI applications; CONNECT Piezoelectric-on-Insulator RF filters for smartphones; photonics and optical sensing solution for the integration of silicon optical components in data centers; and CONNECT RF gallium nitride which increases the frequency system efficiency and power density of next generation sub 6GHz and mmWave-band cellular 5G infrastructures and mobile devices.