Sequans Communications S.A

Research Sequans Communications S.A (SQNS) on Bullrun: market cap USD 40.57M. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is USD 40.57M.

Five-year financial history

YearRevenueNet incomeFree cash flowGross marginDiluted EPSCashTotal debtEquity
FY2025USD 26.33M-USD 109.28M-USD 28.66M53.6%-13USD 13.39MUSD 75.70MUSD 127.68M
FY2024USD 36.83MUSD 57.57M-USD 39.26M75.3%22.69USD 9.09MUSD 16.36MUSD 55.36M
FY2023USD 33.62M-USD 40.99M-USD 36.83M71.8%-18.25USD 5.71MUSD 80.69M-USD 6.07M
FY2022USD 60.55M-USD 9.01M-USD 24.50M70.8%-5USD 5.67MUSD 66.50MUSD 2.10M

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-12USD 40.57Mn/an/an/a
20252025-12-31USD 643.53Mn/an/an/a
20242024-12-31USD 877.42M0.0n/an/a
20232023-12-29USD 1.74Bn/an/an/a
20222022-12-30USD 1.59Bn/an/an/a
20212021-12-31USD 1.79Bn/an/an/a

About Sequans Communications S.A

Sequans Communications S.A., together with its subsidiaries, engages in the fabless design, development, and supply of cellular semiconductor solutions for mass and broadband internet of things markets. It offers baseband solutions for use in encoding and decoding data based on 4G and 5G protocols for wireless processing platforms for a cellular device; RF transceivers used to transmit and receive wireless transmissions;

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Frequently asked questions

What is Sequans Communications S.A's market cap?

Sequans Communications S.A's market capitalization is USD 40.57M.

What does Sequans Communications S.A do?

Sequans Communications S.A., together with its subsidiaries, engages in the fabless design, development, and supply of cellular semiconductor solutions for mass and broadband internet of things markets. It offers baseband solutions for use in encoding and decoding data based on 4G and 5G protocols for wireless processing platforms for a cellular device; RF transceivers used to transmit and receive wireless transmissions; highly integrated system-on-chip solutions that combine various functions into a single die or package; and LTE modules.