Sequans Communications S.A

Research Sequans Communications S.A (SQNS) on Bullrun: market cap USD 44.68M. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is USD 44.68M.

Five-year financial history

YearRevenueNet incomeFree cash flowGross marginDiluted EPSCashTotal debtEquity
FY2025USD 27.19M-USD 102.60Mn/a54.3%n/aUSD 13.40MUSD 68.06MUSD 127.72M
FY2024USD 36.83MUSD 57.90M-USD 39.26M75.3%-1.34USD 9.09MUSD 16.36MUSD 55.36M
FY2023USD 33.62M-USD 40.99Mn/a71.8%n/aUSD 5.71MUSD 80.69M-USD 6.07M
FY2022USD 60.55Mn/an/a70.8%n/aUSD 5.67MUSD 67.59MUSD 6.77M

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-08-25USD 44.68Mn/an/an/a
20252025-12-31USD 643.53Mn/an/an/a
20242024-12-31USD 877.42M0.0n/an/a
20232023-12-29USD 1.74Bn/an/an/a
20222022-12-30USD 1.59Bn/an/an/a
20212021-12-31USD 1.79Bn/an/an/a

About Sequans Communications S.A

Sequans Communications S.A., together with its subsidiaries, engages in the fabless design, development, and supply of cellular semiconductor solutions for mass and broadband internet of things markets. It offers baseband solutions for use in encoding and decoding data based on 4G and 5G protocols for wireless processing platforms for a cellular device; RF transceivers used to transmit and receive wireless transmissions;

Related stock research

Other Technology stocks

Frequently asked questions

What is Sequans Communications S.A's market cap?

Sequans Communications S.A's market capitalization is USD 44.68M.

What does Sequans Communications S.A do?

Sequans Communications S.A., together with its subsidiaries, engages in the fabless design, development, and supply of cellular semiconductor solutions for mass and broadband internet of things markets. It offers baseband solutions for use in encoding and decoding data based on 4G and 5G protocols for wireless processing platforms for a cellular device; RF transceivers used to transmit and receive wireless transmissions; highly integrated system-on-chip solutions that combine various functions into a single die or package; and LTE modules.