HLB innoVation Co.,Ltd.
Research HLB innoVation Co.,Ltd. (024850.KQ) on Bullrun: market cap KRW 524.77B. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker024850.KQ
- ExchangeKQ
- CountrySouth Korea
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CurrencyKRW
- Market capKRW 524.77B
- Financial periodQ2 2026
- RevenueKRW 10.59B
- Net income-KRW 8.29B
- Free cash flow-KRW 8.87B
- Gross margin18.8%
Valuation Snapshot
latest market cap is KRW 524.77B.
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | KRW 524.77B | n/a | n/a | n/a |
Dividend history
About HLB innoVation Co.,Ltd.
HLB innoVation Co.,Ltd. engages in the manufacturing and selling semiconductor components and molds in South Korea and internationally. The company offers various lead frames, such as plastic dual in-line package, plastic leaded chip carrier, small outline integrated circuit, quad flat pack, transistor outline, and other products; lead frame used in smart power modules or intelligent power modules; contact pin;
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Frequently asked questions
What is HLB innoVation Co.,Ltd.'s market cap?
HLB innoVation Co.,Ltd.'s market capitalization is KRW 524.77B.
What does HLB innoVation Co.,Ltd. do?
HLB innoVation Co.,Ltd. engages in the manufacturing and selling semiconductor components and molds in South Korea and internationally. The company offers various lead frames, such as plastic dual in-line package, plastic leaded chip carrier, small outline integrated circuit, quad flat pack, transistor outline, and other products; lead frame used in smart power modules or intelligent power modules; contact pin; and pre-mold products for use in image and pressure sensors for automobiles, medical devices, and optoelectronics.