HANMI Semiconductor Co., Ltd.

Research HANMI Semiconductor Co., Ltd. (042700) on Bullrun: market cap KRW 20.82T, dividend yield 0.4%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is KRW 20.82T; dividend yield is 0.4%.

Peer valuation comparison

Latest dividend yield is 0.36% versus a Technology sector median of 1.65% (78.2% below).

Five-year financial history

YearRevenueNet incomeFree cash flowGross marginDiluted EPSCashTotal debtEquity
FY2025KRW 576.68BKRW 214.01BKRW 134.89B57.6%n/aKRW 276.24BKRW 2.55BKRW 690.33B

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-08-28KRW 20.82Tn/a0.4%800

Dividend history

Latest trailing dividend snapshot: annual dividend/share 800 KRW, yield 0.4%.

About HANMI Semiconductor Co., Ltd.

HANMI Semiconductor Co., Ltd. manufactures and sells semiconductor equipment in South Korea and internationally. The company offers bonder; micro SAW equipment; vision placement equipment; meta grinder; EMI shield vision attach and detach, EMI shield vision placement, EMI shield tape mounter, EMI shield tape laser cutting, EMI shield tape demounter, vision inspection, and converlay attach equipment; laser marking, laser ablation, and laser cutting equipment;

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Frequently asked questions

What is HANMI Semiconductor Co., Ltd.'s market cap?

HANMI Semiconductor Co., Ltd.'s market capitalization is KRW 20.82T.

Does HANMI Semiconductor Co., Ltd. pay a dividend?

HANMI Semiconductor Co., Ltd. has a dividend yield of 0.4%.

What does HANMI Semiconductor Co., Ltd. do?

HANMI Semiconductor Co., Ltd. manufactures and sells semiconductor equipment in South Korea and internationally. The company offers bonder; micro SAW equipment; vision placement equipment; meta grinder; EMI shield vision attach and detach, EMI shield vision placement, EMI shield tape mounter, EMI shield tape laser cutting, EMI shield tape demounter, vision inspection, and converlay attach equipment; laser marking, laser ablation, and laser cutting equipment; and pick and place, strip mounter, and vision inspection equipment. HANMI Semiconductor Co., Ltd.