Confidence Intelligence Holdings Limited

Research Confidence Intelligence Holdings Limited (1967.HK) on Bullrun: market cap HKD 76.50M. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is HKD 76.50M.

Five-year financial history

YearRevenueNet incomeFree cash flowGross marginDiluted EPSCashTotal debtEquity
FY2025CNY 267.34MCNY 3.89M-CNY 6.15M14.8%n/aCNY 64.31MCNY 3.27MCNY 251.12M
FY2024CNY 288.83MCNY 1.60MCNY 36.94M15.5%0.01CNY 73.72MCNY 9.93MCNY 263.39M
FY2023CNY 264.46M-CNY 23.84M-CNY 37.84M6.3%-0.1CNY 60.70MCNY 12.00MCNY 262.54M
FY2022CNY 260.51M-CNY 9.08MCNY 68.78M10.8%-0.04CNY 111.50MCNY 17.70MCNY 288.02M
FY2021n/an/an/an/a0.03n/an/an/a

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18HKD 76.50Mn/an/a0

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0 HKD.

About Confidence Intelligence Holdings Limited

Confidence Intelligence Holdings Limited, an investment holding company, provides electronic manufacturing services in the People's Republic of China. The company offers assembling and production services of printed circuit board assembly (PCBAs) that integrate research, designing, selection, and procurement of raw materials, assembling of PCBAs, quality control, testing, logistics, and aftersales services.

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Frequently asked questions

What is Confidence Intelligence Holdings Limited's market cap?

Confidence Intelligence Holdings Limited's market capitalization is HKD 76.50M.

What does Confidence Intelligence Holdings Limited do?

Confidence Intelligence Holdings Limited, an investment holding company, provides electronic manufacturing services in the People's Republic of China. The company offers assembling and production services of printed circuit board assembly (PCBAs) that integrate research, designing, selection, and procurement of raw materials, assembling of PCBAs, quality control, testing, logistics, and aftersales services. Its products are used in electronic end products for telecommunication devices, IoT products, and automotive related devices.