Nexchip Semiconductor Corporation
Research Nexchip Semiconductor Corporation (2249.HK) on Bullrun: market cap HKD 42.01B, P/E 52.2. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker2249.HK
- ExchangeHK
- CountryChina
- SectorTechnology
- IndustrySemiconductors
- CurrencyHKD
- Market capHKD 42.01B
- P/E52.2
- Financial periodQ2 2026
- RevenueCNY 3.04B
- Net incomeCNY 194.71M
- Free cash flow-CNY 703.41M
- Gross margin22.1%
Valuation Snapshot
latest market cap is HKD 42.01B; P/E is 52.2.
Peer valuation comparison
Latest P/E is 52.22x versus a Technology sector median of 24.16x (116.2% above).
Latest P/E is 52.22x versus a China median of 16.26x (221.1% above).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | HKD 42.01B | 52.2 | n/a | 0 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 0 HKD.
About Nexchip Semiconductor Corporation
Nexchip Semiconductor Corporation engages in the research, development, production, and sale of integrated circuit related products in China and internationally. The company operates a foundry specializing in wafer manufacturing. It offers various integrated circuit categories, including display driver ICs (DDIC) that enable display control, complementary metal-oxide-semiconductor image sensors (CIS) that enable image sensing; power management ICs (PMIC) that regulate and optimize power usage;
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Frequently asked questions
What is Nexchip Semiconductor Corporation's market cap?
Nexchip Semiconductor Corporation's market capitalization is HKD 42.01B.
What is Nexchip Semiconductor Corporation's P/E ratio?
Nexchip Semiconductor Corporation's price-to-earnings (P/E) ratio is 52.2.
What does Nexchip Semiconductor Corporation do?
Nexchip Semiconductor Corporation engages in the research, development, production, and sale of integrated circuit related products in China and internationally. The company operates a foundry specializing in wafer manufacturing. It offers various integrated circuit categories, including display driver ICs (DDIC) that enable display control, complementary metal-oxide-semiconductor image sensors (CIS) that enable image sensing; power management ICs (PMIC) that regulate and optimize power usage; and Logic ICs, which support data processing, and microcontroller units (MCU).