Black Sesame International Holding Limited

Research Black Sesame International Holding Limited (2533.HK) on Bullrun: market cap HKD 5.64B. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is HKD 5.64B.

Five-year financial history

YearRevenueNet incomeFree cash flowGross marginDiluted EPSCashTotal debtEquity
FY2025CNY 822.33M-CNY 1.42B-CNY 1.07B41.0%n/aCNY 1.45BCNY 778.57MCNY 1.16B
FY2024CNY 474.25MCNY 313.32M-CNY 1.25B41.1%1.2CNY 1.45BCNY 722.40MCNY 1.09B
FY2023CNY 312.39M-CNY 4.86B-CNY 1.19B24.7%-8.53CNY 1.30BCNY 52.45M-CNY 11.09B
FY2022CNY 165.44M-CNY 2.75B-CNY 825.76M29.4%-4.84CNY 982.23MCNY 82.63M-CNY 6.51B
FY2021n/an/an/an/a-4.14n/an/an/a

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18HKD 5.64Bn/an/a0

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0 HKD.

About Black Sesame International Holding Limited

Black Sesame International Holding Limited, an investment holding company, provides autonomous driving system on chip (SoC) and SoC based solutions. The company's automotive-grade SoCs includes the Huashan series automotive grade high computing power autonomous driving chip; SesameX Platform, a full-stack self-evolving and whole-brain AI platform; hanhai autonomous driving middleware platform;

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Frequently asked questions

What is Black Sesame International Holding Limited's market cap?

Black Sesame International Holding Limited's market capitalization is HKD 5.64B.

What does Black Sesame International Holding Limited do?

Black Sesame International Holding Limited, an investment holding company, provides autonomous driving system on chip (SoC) and SoC based solutions. The company's automotive-grade SoCs includes the Huashan series automotive grade high computing power autonomous driving chip; SesameX Platform, a full-stack self-evolving and whole-brain AI platform; hanhai autonomous driving middleware platform; and the Wudang series cross-domain computing platform for intelligent vehicles, such as advanced driving assistance system, smart cockpit, advanced imaging, and interconnection.