Tokyo Seimitsu Co., Ltd.

Research Tokyo Seimitsu Co., Ltd. (7729.T) on Bullrun: market cap JPY 732.24B, P/E 28.1, dividend yield 1.8%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is JPY 732.24B; P/E is 28.1; dividend yield is 1.8%.

Peer valuation comparison

Latest P/E is 28.13x versus a Technology sector median of 24.16x (16.4% above).

Latest dividend yield is 1.8% versus a Technology sector median of 2.02% (10.9% below).

Five-year financial history

YearRevenueNet incomeFree cash flowGross marginDiluted EPSCashTotal debtEquity
FY2026JPY 166.84BJPY 24.74BJPY 13.38B41.3%606.14JPY 53.07BJPY 14.71BJPY 191.70B
FY2025JPY 150.53BJPY 25.64BJPY 18.59B41.5%628.31JPY 54.54BJPY 20.08BJPY 175.17B
FY2024JPY 134.68BJPY 19.38B-JPY 5.96B40.7%475.42JPY 36.78BJPY 25.17BJPY 157.64B
FY2023JPY 146.80BJPY 23.63B-JPY 8.06B42.1%575.62JPY 40.08BJPY 14.19BJPY 145.36B

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18JPY 732.24B28.11.7%304

Dividend history

Latest trailing dividend snapshot: annual dividend/share 304 JPY, yield 1.8%.

YearDividends/share
FY2026303 JPY
FY2025250 JPY
FY2024217 JPY
FY2023215 JPY
FY2022210 JPY

About Tokyo Seimitsu Co., Ltd.

Tokyo Seimitsu Co., Ltd., together with its subsidiaries, manufactures and sells semiconductor manufacturing equipment and measuring instruments in Japan, China, Taiwan, South Korea, rest of East Asia, Southeast Asia, and internationally.

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Frequently asked questions

What is Tokyo Seimitsu Co., Ltd.'s market cap?

Tokyo Seimitsu Co., Ltd.'s market capitalization is JPY 732.24B.

What is Tokyo Seimitsu Co., Ltd.'s P/E ratio?

Tokyo Seimitsu Co., Ltd.'s price-to-earnings (P/E) ratio is 28.1.

Does Tokyo Seimitsu Co., Ltd. pay a dividend?

Tokyo Seimitsu Co., Ltd. has a dividend yield of 1.8%.

What does Tokyo Seimitsu Co., Ltd. do?

Tokyo Seimitsu Co., Ltd., together with its subsidiaries, manufactures and sells semiconductor manufacturing equipment and measuring instruments in Japan, China, Taiwan, South Korea, rest of East Asia, Southeast Asia, and internationally. The company offers wafer dicing and probing machines, polish and high rigid grinders, wafer manufacturing machines, chemical mechanical planarizers, edge shaping products, sliced wafer demounting and cleaning machines, precision dicing blades, and equipment for dicing and probing machines.