BE SEMICON.INDS NY EO091
Research BE SEMICON.INDS NY EO091 (BSIA) on Bullrun: market cap EUR 15.60B, P/E 75.2, dividend yield 0.8%. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- TickerBSIA
- ExchangeF
- CountryNetherlands
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CurrencyEUR
- Market capEUR 15.60B
- P/E75.2
- Dividend yield0.8%
- Financial periodQ2 2026
- RevenueEUR 249.87M
- Net incomeEUR 89.01M
- Free cash flowEUR 38.57M
- Gross margin65.7%
Valuation Snapshot
latest market cap is EUR 15.60B; P/E is 75.2; dividend yield is 0.8%.
Peer valuation comparison
Latest P/E is 75.19x versus a Technology sector median of 28.57x (163.1% above).
Latest dividend yield is 0.84% versus a Technology sector median of 1.65% (49.1% below).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-07-28 | EUR 15.60B | 75.2 | 0.7% | 1.58 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 1.58 EUR, yield 0.8%.
About BE SEMICON.INDS NY EO091
BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating.
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Frequently asked questions
What is BE SEMICON.INDS NY EO091's market cap?
BE SEMICON.INDS NY EO091's market capitalization is EUR 15.60B.
What is BE SEMICON.INDS NY EO091's P/E ratio?
BE SEMICON.INDS NY EO091's price-to-earnings (P/E) ratio is 75.2.
Does BE SEMICON.INDS NY EO091 pay a dividend?
BE SEMICON.INDS NY EO091 has a dividend yield of 0.8%.
What does BE SEMICON.INDS NY EO091 do?
BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating.