Tianshui Huatian Technology Co Ltd
Research Tianshui Huatian Technology Co Ltd (002185.SZ) on Bullrun: market cap CNY 46.67B, P/E 36.0, dividend yield 0.2%. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker002185.SZ
- ExchangeSZ
- CountryChina
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CurrencyCNY
- Market capCNY 46.67B
- P/E36.0
- Dividend yield0.2%
- Financial periodQ2 2026
- RevenueCNY 5.71B
- Net incomeCNY 726.62M
- Free cash flow-CNY 1.40B
- Gross margin16.9%
Valuation Snapshot
latest market cap is CNY 46.67B; P/E is 36.0; dividend yield is 0.2%.
Peer valuation comparison
Latest P/E is 35.97x versus a Technology sector median of 24.16x (48.9% above).
Latest dividend yield is 0.15% versus a Technology sector median of 2.02% (92.6% below).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | CNY 46.67B | 36.0 | 0.2% | 0.02 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 0.02 CNY, yield 0.2%.
About Tianshui Huatian Technology Co Ltd
Tianshui Huatian Technology Co., Ltd., together with its subsidiaries, engages in research, development, production, packaging, testing, and sales of semiconductor integrated circuits in China and internationally. It offers integrated circuit packaging products, including multiple series such as DIP, SOT, SOP, QFP, QFN/DFN, BGA/LGA, FC, MCM, SiP, WLP, TSV, Bumping, MEMS, FO, PLP, and 2.5D/3D.
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Frequently asked questions
What is Tianshui Huatian Technology Co Ltd's market cap?
Tianshui Huatian Technology Co Ltd's market capitalization is CNY 46.67B.
What is Tianshui Huatian Technology Co Ltd's P/E ratio?
Tianshui Huatian Technology Co Ltd's price-to-earnings (P/E) ratio is 36.0.
Does Tianshui Huatian Technology Co Ltd pay a dividend?
Tianshui Huatian Technology Co Ltd has a dividend yield of 0.2%.
What does Tianshui Huatian Technology Co Ltd do?
Tianshui Huatian Technology Co., Ltd., together with its subsidiaries, engages in research, development, production, packaging, testing, and sales of semiconductor integrated circuits in China and internationally. It offers integrated circuit packaging products, including multiple series such as DIP, SOT, SOP, QFP, QFN/DFN, BGA/LGA, FC, MCM, SiP, WLP, TSV, Bumping, MEMS, FO, PLP, and 2.5D/3D.