Tianshui Huatian Technology Co Ltd

Research Tianshui Huatian Technology Co Ltd (002185.SZ) on Bullrun: market cap CNY 46.67B, P/E 36.0, dividend yield 0.2%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is CNY 46.67B; P/E is 36.0; dividend yield is 0.2%.

Peer valuation comparison

Latest P/E is 35.97x versus a Technology sector median of 24.16x (48.9% above).

Latest dividend yield is 0.15% versus a Technology sector median of 2.02% (92.6% below).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18CNY 46.67B36.00.2%0.02

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0.02 CNY, yield 0.2%.

About Tianshui Huatian Technology Co Ltd

Tianshui Huatian Technology Co., Ltd., together with its subsidiaries, engages in research, development, production, packaging, testing, and sales of semiconductor integrated circuits in China and internationally. It offers integrated circuit packaging products, including multiple series such as DIP, SOT, SOP, QFP, QFN/DFN, BGA/LGA, FC, MCM, SiP, WLP, TSV, Bumping, MEMS, FO, PLP, and 2.5D/3D.

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Frequently asked questions

What is Tianshui Huatian Technology Co Ltd's market cap?

Tianshui Huatian Technology Co Ltd's market capitalization is CNY 46.67B.

What is Tianshui Huatian Technology Co Ltd's P/E ratio?

Tianshui Huatian Technology Co Ltd's price-to-earnings (P/E) ratio is 36.0.

Does Tianshui Huatian Technology Co Ltd pay a dividend?

Tianshui Huatian Technology Co Ltd has a dividend yield of 0.2%.

What does Tianshui Huatian Technology Co Ltd do?

Tianshui Huatian Technology Co., Ltd., together with its subsidiaries, engages in research, development, production, packaging, testing, and sales of semiconductor integrated circuits in China and internationally. It offers integrated circuit packaging products, including multiple series such as DIP, SOT, SOP, QFP, QFN/DFN, BGA/LGA, FC, MCM, SiP, WLP, TSV, Bumping, MEMS, FO, PLP, and 2.5D/3D.