Jiangsu Yoke Technology Co Ltd

Research Jiangsu Yoke Technology Co Ltd (002409.SZ) on Bullrun: market cap CNY 46.65B, P/E 45.0, dividend yield 0.7%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is CNY 46.65B; P/E is 45.0; dividend yield is 0.7%.

Peer valuation comparison

Latest P/E is 44.96x versus a Technology sector median of 24.16x (86.1% above).

Latest dividend yield is 0.68% versus a Technology sector median of 2.02% (66.3% below).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18CNY 46.65B45.00.7%0.7

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0.7 CNY, yield 0.7%.

About Jiangsu Yoke Technology Co Ltd

Jiangsu Yoke Technology Co., Ltd. engages in the electronic materials, liquefied natural gas (LNG) thermal insulation board related, and flame-retardant businesses in China and internationally. The company provides electronic material products, including semiconductor precursor materials/spin-on-insulation dielectric (SOD), photoresist and supporting reagents, electronic special gases, silicon micropowder products, semiconductor material delivery system (LDS), etc.

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Frequently asked questions

What is Jiangsu Yoke Technology Co Ltd's market cap?

Jiangsu Yoke Technology Co Ltd's market capitalization is CNY 46.65B.

What is Jiangsu Yoke Technology Co Ltd's P/E ratio?

Jiangsu Yoke Technology Co Ltd's price-to-earnings (P/E) ratio is 45.0.

Does Jiangsu Yoke Technology Co Ltd pay a dividend?

Jiangsu Yoke Technology Co Ltd has a dividend yield of 0.7%.

What does Jiangsu Yoke Technology Co Ltd do?

Jiangsu Yoke Technology Co., Ltd. engages in the electronic materials, liquefied natural gas (LNG) thermal insulation board related, and flame-retardant businesses in China and internationally. The company provides electronic material products, including semiconductor precursor materials/spin-on-insulation dielectric (SOD), photoresist and supporting reagents, electronic special gases, silicon micropowder products, semiconductor material delivery system (LDS), etc.