Ferrotec (An Hui) Technology Development Co.,LTD

Research Ferrotec (An Hui) Technology Development Co.,LTD (301297.SZ) on Bullrun: market cap CNY 24.96B, P/E 47.9, dividend yield 0.5%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is CNY 24.96B; P/E is 47.9; dividend yield is 0.5%.

Peer valuation comparison

Latest P/E is 47.86x versus a Technology sector median of 24.16x (98.1% above).

Latest dividend yield is 0.47% versus a Technology sector median of 2.02% (76.7% below).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18CNY 24.96B47.90.5%0.17

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0.17 CNY, yield 0.5%.

About Ferrotec (An Hui) Technology Development Co.,LTD

Ferrotec (An Hui) Technology Development Co.,LTD provides precision cleaning services for semiconductor and display panel manufacturers in China and internationally. The company offers semiconductor, TFT, and OLED equipment cleaning services; and precision cleaning derivative value-added services, such as oxidation processing, ceramic spraying, and semiconductor equipment repair services.

Related stock research

Other Technology stocks

Frequently asked questions

What is Ferrotec (An Hui) Technology Development Co.,LTD's market cap?

Ferrotec (An Hui) Technology Development Co.,LTD's market capitalization is CNY 24.96B.

What is Ferrotec (An Hui) Technology Development Co.,LTD's P/E ratio?

Ferrotec (An Hui) Technology Development Co.,LTD's price-to-earnings (P/E) ratio is 47.9.

Does Ferrotec (An Hui) Technology Development Co.,LTD pay a dividend?

Ferrotec (An Hui) Technology Development Co.,LTD has a dividend yield of 0.5%.

What does Ferrotec (An Hui) Technology Development Co.,LTD do?

Ferrotec (An Hui) Technology Development Co.,LTD provides precision cleaning services for semiconductor and display panel manufacturers in China and internationally. The company offers semiconductor, TFT, and OLED equipment cleaning services; and precision cleaning derivative value-added services, such as oxidation processing, ceramic spraying, and semiconductor equipment repair services. It is also involved in research, development, production and sales of copper-clad ceramic substrates comprising direct copper bonding, active metal brazing, and direct plated copper products.