Koh Young Technology Inc.

Research Koh Young Technology Inc. (098460.KQ) on Bullrun: market cap KRW 2.17T, dividend yield 0.4%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is KRW 2.17T; dividend yield is 0.4%.

Peer valuation comparison

Latest dividend yield is 0.44% versus a Technology sector median of 2% (78.0% below).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18KRW 2.17Tn/a0.4%140

Dividend history

Latest trailing dividend snapshot: annual dividend/share 140 KRW, yield 0.4%.

About Koh Young Technology Inc.

Koh Young Technology Inc. engages in the manufacturing and sale of automated inspection and precise measurement systems and equipment in South Korea and internationally. The company's products portfolio comprises solder paste, automated optical, semiconductor, dispensing process, and final optical inspection equipment; smart factory solutions comprising KSMART solution, a 3D measurement-based process control system; KPO printers, an AI-based automatic printing process optimizer;

Related stock research

Other Technology stocks

Frequently asked questions

What is Koh Young Technology Inc.'s market cap?

Koh Young Technology Inc.'s market capitalization is KRW 2.17T.

Does Koh Young Technology Inc. pay a dividend?

Koh Young Technology Inc. has a dividend yield of 0.4%.

What does Koh Young Technology Inc. do?

Koh Young Technology Inc. engages in the manufacturing and sale of automated inspection and precise measurement systems and equipment in South Korea and internationally. The company's products portfolio comprises solder paste, automated optical, semiconductor, dispensing process, and final optical inspection equipment; smart factory solutions comprising KSMART solution, a 3D measurement-based process control system; KPO printers, an AI-based automatic printing process optimizer; and KPO mounters, an AI-based automatic mounting process optimizer; and medical robots.