Greatek Electronics Inc.

Research Greatek Electronics Inc. (2441.TW) on Bullrun: market cap TWD 68.10B, P/E 22.5, dividend yield 2.6%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is TWD 68.10B; P/E is 22.5; dividend yield is 2.6%.

Peer valuation comparison

Latest P/E is 22.53x versus a Technology sector median of 24.16x (6.7% below).

Latest dividend yield is 2.56% versus a Technology sector median of 2.02% (26.7% above).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18TWD 68.10B22.52.5%3.01

Dividend history

Latest trailing dividend snapshot: annual dividend/share 3.01 TWD, yield 2.6%.

About Greatek Electronics Inc.

Greatek Electronics Inc., together with its subsidiary, provides semiconductor assembly and testing services in Taiwan, rest of Asia, the United States, Europe, and Africa. The company offers wafer and final testing services, including testing program development, platform conversion, devices correlation, engineering, test peripheral equipment, and spare parts development service for logic, mix mode, and analog devices; IC semiconductor package assembly services; final test services;

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Frequently asked questions

What is Greatek Electronics Inc.'s market cap?

Greatek Electronics Inc.'s market capitalization is TWD 68.10B.

What is Greatek Electronics Inc.'s P/E ratio?

Greatek Electronics Inc.'s price-to-earnings (P/E) ratio is 22.5.

Does Greatek Electronics Inc. pay a dividend?

Greatek Electronics Inc. has a dividend yield of 2.6%.

What does Greatek Electronics Inc. do?

Greatek Electronics Inc., together with its subsidiary, provides semiconductor assembly and testing services in Taiwan, rest of Asia, the United States, Europe, and Africa. The company offers wafer and final testing services, including testing program development, platform conversion, devices correlation, engineering, test peripheral equipment, and spare parts development service for logic, mix mode, and analog devices; IC semiconductor package assembly services; final test services; and package design services for electrical and thermal characterization.