Spirox Corporation
Research Spirox Corporation (3055.TW) on Bullrun: market cap TWD 15.90B, dividend yield 0.4%. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker3055.TW
- ExchangeTW
- CountryTaiwan
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CurrencyTWD
- Market capTWD 15.90B
- Dividend yield0.4%
- Financial periodQ2 2026
- RevenueTWD 162.44M
- Net incomeTWD 13.64M
- Free cash flow-TWD 51.72M
- Gross margin31.7%
Valuation Snapshot
latest market cap is TWD 15.90B; dividend yield is 0.4%.
Peer valuation comparison
Latest dividend yield is 0.35% versus a Technology sector median of 2.02% (82.7% below).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | TWD 15.90B | n/a | 0.4% | 0.5 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 0.5 TWD, yield 0.4%.
About Spirox Corporation
Spirox Corporation provides semiconductor equipment in Taiwan, China, and internationally. The company offers laser tomography scan system, including non-destructive TGV laser modification inspection system; IC testing equipment, such as ATE, handler, and interface; packaging equipment, consists reflow oven, plasma cleaner, TCB bonder, warpage adjustment, and thermal debonding;
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Frequently asked questions
What is Spirox Corporation's market cap?
Spirox Corporation's market capitalization is TWD 15.90B.
Does Spirox Corporation pay a dividend?
Spirox Corporation has a dividend yield of 0.4%.
What does Spirox Corporation do?
Spirox Corporation provides semiconductor equipment in Taiwan, China, and internationally. The company offers laser tomography scan system, including non-destructive TGV laser modification inspection system; IC testing equipment, such as ATE, handler, and interface; packaging equipment, consists reflow oven, plasma cleaner, TCB bonder, warpage adjustment, and thermal debonding; lab wafer and chip inspection equipment, comprising surface topography inspection and material characteristic analysis, defect inspection, FA, and ESD; mass production chip inspection equipment, contains automated.