Advanced Process Systems Corporation
Research Advanced Process Systems Corporation (265520.KQ) on Bullrun: market cap KRW 257.76B, dividend yield 1.9%. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker265520.KQ
- ExchangeKQ
- CountrySouth Korea
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CurrencyKRW
- Market capKRW 257.76B
- Dividend yield1.9%
- Financial periodQ2 2026
- RevenueKRW 162.84B
- Net incomeKRW 9.49B
- Free cash flowKRW 11.04B
- Gross margin15.1%
Valuation Snapshot
latest market cap is KRW 257.76B; dividend yield is 1.9%.
Peer valuation comparison
Latest dividend yield is 1.94% versus a Technology sector median of 2% (3.0% below).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | KRW 257.76B | n/a | 1.9% | 340 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 340 KRW, yield 1.9%.
About Advanced Process Systems Corporation
Advanced Process Systems Corporation develops and sells semiconductors and display manufacturing equipment primarily in South Korea, China, and Vietnam. It offers semiconductor, such as rapid thermal process, sputter system, descum system, laser dicing, laser de-bonder, wafer dicing, and laser and laser ablation. The company also provides displays excimer laser annealing, laser lift-off, glass encapsulation, ALD, film laser cutting, and PECVD for front end process;
Related stock research
Other Technology stocks
Frequently asked questions
What is Advanced Process Systems Corporation's market cap?
Advanced Process Systems Corporation's market capitalization is KRW 257.76B.
Does Advanced Process Systems Corporation pay a dividend?
Advanced Process Systems Corporation has a dividend yield of 1.9%.
What does Advanced Process Systems Corporation do?
Advanced Process Systems Corporation develops and sells semiconductors and display manufacturing equipment primarily in South Korea, China, and Vietnam. It offers semiconductor, such as rapid thermal process, sputter system, descum system, laser dicing, laser de-bonder, wafer dicing, and laser and laser ablation. The company also provides displays excimer laser annealing, laser lift-off, glass encapsulation, ALD, film laser cutting, and PECVD for front end process; and module lamination, dispenser, and OCR inkjet for back end process.