Shanghai Biren Technology Co., Ltd.

Research Shanghai Biren Technology Co., Ltd. (6082.HK) on Bullrun: market cap HKD 68.58B. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is HKD 68.58B.

Five-year financial history

YearRevenueNet incomeFree cash flowGross marginDiluted EPSCashTotal debtEquity
FY2025CNY 1.03B-CNY 16.49B-CNY 2.49B53.8%-8.72CNY 1.04BCNY 236.46M-CNY 23.84B
FY2024CNY 336.80M-CNY 1.54B-CNY 1.11B53.2%-0.81CNY 1.10BCNY 302.76M-CNY 7.42B
FY2023CNY 62.03M-CNY 1.74B-CNY 986.05M76.4%-0.74CNY 659.34MCNY 17.99M-CNY 5.97B
FY2022CNY 499.00K-CNY 1.47B-CNY 1.38B100.0%-0.62CNY 983.33MCNY 43.02M-CNY 4.31B

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18HKD 68.58Bn/an/a0

Dividend history

Latest trailing dividend snapshot: annual dividend/share 0 HKD.

About Shanghai Biren Technology Co., Ltd.

Shanghai Biren Technology Co., Ltd. operates as a graphics processing unit (GPU) developer that researches and develops general computing systems. The company's products include Wall-Sharpening 166L, a cold-plate liquid-cooled OAM module; Wall-Sharpening 166M, a 4U OAM V1.1 air-cooled module; Wall-Sharpening 166C, a full-height and full-length, dual-width PCIe card; Wall-Sharpening 106M, an air-cooled OAM module; and Wall-Sharp 106B, a full-height, full-length, dual-width PCIe board.

Related stock research

Other Technology stocks

Frequently asked questions

What is Shanghai Biren Technology Co., Ltd.'s market cap?

Shanghai Biren Technology Co., Ltd.'s market capitalization is HKD 68.58B.

What does Shanghai Biren Technology Co., Ltd. do?

Shanghai Biren Technology Co., Ltd. operates as a graphics processing unit (GPU) developer that researches and develops general computing systems. The company's products include Wall-Sharpening 166L, a cold-plate liquid-cooled OAM module; Wall-Sharpening 166M, a 4U OAM V1.1 air-cooled module; Wall-Sharpening 166C, a full-height and full-length, dual-width PCIe card; Wall-Sharpening 106M, an air-cooled OAM module; and Wall-Sharp 106B, a full-height, full-length, dual-width PCIe board. The company also provides BIRENSUPA, a software development platform.