Niching Industrial Corporation

Research Niching Industrial Corporation (3444.TWO) on Bullrun: market cap TWD 3.26B, P/E 36.4, dividend yield 2.3%. Explore financials, valuation history, model signals, and stock context.

Key Metrics

Valuation Snapshot

latest market cap is TWD 3.26B; P/E is 36.4; dividend yield is 2.3%.

Peer valuation comparison

Latest P/E is 36.38x versus a Technology sector median of 23.76x (53.1% above).

Latest dividend yield is 2.29% versus a Technology sector median of 2.17% (5.5% above).

Valuation history

YearSnapshot dateMarket capP/EDividend yieldAnnual dividend/share
20262026-10-18TWD 3.26B36.42.5%1.8

Dividend history

Latest trailing dividend snapshot: annual dividend/share 1.8 TWD, yield 2.3%.

About Niching Industrial Corporation

Niching Industrial Corporation operates as a sales agent of semiconductors, flat panel displays, LEDs, green energy, and nanotechnology in Taiwan, the rest of Asia, and internationally. It provides silver pastes products, including customized silver paste, hybrid silver sintering paste, snap cure anisotropic conductive paste, conductive silver paste, and screen-printed silver paste; semiconductor package substrate, such as memory and system ICs;

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Frequently asked questions

What is Niching Industrial Corporation's market cap?

Niching Industrial Corporation's market capitalization is TWD 3.26B.

What is Niching Industrial Corporation's P/E ratio?

Niching Industrial Corporation's price-to-earnings (P/E) ratio is 36.4.

Does Niching Industrial Corporation pay a dividend?

Niching Industrial Corporation has a dividend yield of 2.3%.

What does Niching Industrial Corporation do?

Niching Industrial Corporation operates as a sales agent of semiconductors, flat panel displays, LEDs, green energy, and nanotechnology in Taiwan, the rest of Asia, and internationally. It provides silver pastes products, including customized silver paste, hybrid silver sintering paste, snap cure anisotropic conductive paste, conductive silver paste, and screen-printed silver paste; semiconductor package substrate, such as memory and system ICs; and vacuum valves comprising butterfly, pendulum, gate, and anti-fouling angle valve.