Forcera Materials Co., Ltd.
Research Forcera Materials Co., Ltd. (3467.TWO) on Bullrun: market cap TWD 1.97B, P/E 54.8, dividend yield 0.7%. Explore financials, valuation history, model signals, and stock context.
Key Metrics
- Ticker3467.TWO
- ExchangeTWO
- CountryTaiwan
- SectorTechnology
- IndustrySemiconductor Equipment & Materials
- CurrencyTWD
- Market capTWD 1.97B
- P/E54.8
- Dividend yield0.7%
- Financial periodQ2 2026
- RevenueTWD 206.25M
- Net incomeTWD 15.41M
- Free cash flow-TWD 7.10M
- Gross margin24.8%
Valuation Snapshot
latest market cap is TWD 1.97B; P/E is 54.8; dividend yield is 0.7%.
Peer valuation comparison
Latest P/E is 54.82x versus a Technology sector median of 23.76x (130.7% above).
Latest dividend yield is 0.73% versus a Technology sector median of 2.17% (66.4% below).
Valuation history
| Year | Snapshot date | Market cap | P/E | Dividend yield | Annual dividend/share |
|---|---|---|---|---|---|
| 2026 | 2026-10-18 | TWD 1.97B | 54.8 | 0.8% | 0.5 |
Dividend history
Latest trailing dividend snapshot: annual dividend/share 0.5 TWD, yield 0.7%.
About Forcera Materials Co., Ltd.
Forcera Materials Co., Ltd. manufactures and sells consumable spare parts for semiconductor and ceramic material industries in Taiwan and internationally. The company's products include aluminum oxide, quartz, aluminum nitride, and silicon.
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Frequently asked questions
What is Forcera Materials Co., Ltd.'s market cap?
Forcera Materials Co., Ltd.'s market capitalization is TWD 1.97B.
What is Forcera Materials Co., Ltd.'s P/E ratio?
Forcera Materials Co., Ltd.'s price-to-earnings (P/E) ratio is 54.8.
Does Forcera Materials Co., Ltd. pay a dividend?
Forcera Materials Co., Ltd. has a dividend yield of 0.7%.
What does Forcera Materials Co., Ltd. do?
Forcera Materials Co., Ltd. manufactures and sells consumable spare parts for semiconductor and ceramic material industries in Taiwan and internationally. The company's products include aluminum oxide, quartz, aluminum nitride, and silicon. Its products are used in various applications, including semiconductor chamber component, TFT.LCD chamber component, high and well-plasma/chemical resistance require, precision/structure ceramic component, semiconductor etch process, semiconductor PVD process, ring shape, and cathode applications.